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[1.9 MB PDF download]

The SEI Year in Review describes the accomplishments of the SEI during fiscal year 2008 (October 1, 2007, through September 30, 2008). This Year in Review highlights a few ways the SEI creates customer solutions across a spectrum of challenges in areas ranging from digital forensics and process management to acquisition and architecture. Current examples highlighted in this issue include:

• Collaborations with the Army Strategic Software Improvement Program (ASSIP) to establish a stronger, more efficient, and more capable software community within the Army
• Creation of a comprehensive new set of tools and methods in computer forensics to help law enforcement capture crucial digital evidence for some high-profile cases
• Adoption of SEI’s Team Software Process (TSP) methodology by the Mexican government in its work to build a national reputation as a provider of IT products and services
• Recognition by the Aerospace Vehicle Systems Institute (AVSI) of the SEI-developed Architecture Analysis and Design Language (AADL) as the ideal tool to help plan and build next-generation aerospace systems

The report also presents information about the SEI, its staff members, and its organization, including publications, demographics, technology-transition activities, and funding data.

The Year in Review is divided into two parts. The first part is a printed comprehensive overview and is available as a PDF. The second part, not included in the printed version, is available from the links above.

To obtain a printed copy of the SEI Annual Report, contact SEI Customer Relations at
1-888-201-4479 or customer-relations@sei.cmu.edu.

Take Our Survey

If you read the Year in Review, would you also take a few minutes to complete our online reader survey. Everyone who completes the survey before May 31, 2009, will have the opportunity to enter a drawing to win a free SEI gift basket.

To obtain a printed copy of the SEI Annual Report, contact SEI Customer Relations at
1-888-201-4479 or customer-relations@sei.cmu.edu.