Packaging Predictable Assembly with Prediction-Enabled Component Technology
• SEI Report
Publisher
Software Engineering Institute
CMU/SEI Report Number
CMU/SEI-2001-TR-024DOI (Digital Object Identifier)
10.1184/R1/6576023.v1Abstract
This report describes the use of prediction-enabled component technology (PECT) as a means of packaging predictable assembly as a deployable product. A PECT results from integrating a component technology with one or more analysis technologies. Analysis technologies allow analysis and prediction of assembly-level properties prior to component assembly, and, presumably, prior to component acquisition. Analysis technologies also identify required component properties and their certifiable descriptions. This report describes the major structures of a PECT. It then discusses the means of validating the predictive powers of a PECT so that consumers may obtain measurably bounded trust in design-time predictions. Last, it demonstrates the above concepts in a simple but illustrative model problem: predicting average end-to-end latency of a soft real-time application built from off-the-shelf software components.
Cite This SEI Report
Hissam, S., Moreno, G., Stafford, J., & Wallnau, K. (2001, November 1). Packaging Predictable Assembly with Prediction-Enabled Component Technology. (SEI Report CMU/SEI-2001-TR-024). Retrieved June 18, 2026, from https://doi.org/10.1184/R1/6576023.v1.
@techreport{hissam_2001,
author={Hissam, Scott and Moreno, Gabriel and Stafford, Judith and Wallnau, Kurt},
title={Packaging Predictable Assembly with Prediction-Enabled Component Technology},
month={Nov},
year={2001},
number={{CMU/SEI-2001-TR-024},
institution={Software Engineering Institute, Carnegie Mellon University},
doi={10.1184/R1/6576023.v1},
url={https://doi.org/10.1184/R1/6576023.v1},
note={Accessed: 2026-Jun-18}
}
Hissam, Scott, Gabriel Moreno, Judith Stafford, and Kurt Wallnau. "Packaging Predictable Assembly with Prediction-Enabled Component Technology." (CMU/SEI-2001-TR-024). Software Engineering Institute, Carnegie Mellon University. Software Engineering Institute, November 1, 2001. https://doi.org/10.1184/R1/6576023.v1.
S. Hissam, G. Moreno, J. Stafford, and K. Wallnau, "Packaging Predictable Assembly with Prediction-Enabled Component Technology," Software Engineering Institute, Carnegie Mellon University. Software Engineering Institute, SEI Report CMU/SEI-2001-TR-024, 1-Nov-2001 [Online]. Available: https://doi.org/10.1184/R1/6576023.v1. [Accessed: 18-Jun-2026].
Hissam, Scott, Gabriel Moreno, Judith Stafford, and Kurt Wallnau. "Packaging Predictable Assembly with Prediction-Enabled Component Technology." (SEI Report CMU/SEI-2001-TR-024). Software Engineering Institute, Carnegie Mellon University, Software Engineering Institute, 1 Nov. 2001. https://doi.org/10.1184/R1/6576023.v1. Accessed 18 Jun. 2026.
Hissam, Scott; Moreno, Gabriel; Stafford, Judith; & Wallnau, Kurt. Packaging Predictable Assembly with Prediction-Enabled Component Technology. CMU/SEI-2001-TR-024. Software Engineering Institute. 2001. DOI: 10.1184/R1/6576023.v1. https://doi.org/10.1184/R1/6576023.v1